I use tin plating with thickness 5.5 micron over steel, when it undergo soldering at 220 degree C, the plated surface form cluster causing rough surface. what thickness should i use or other plating materials to be recommended to overcome rough surface? i had tried silver and gold plating, its good but cost too high.
2007-09-19 05:02:55 · 3 answers · asked by Erica L 3 in Science & Mathematics ➔ Engineering
I've had similar problem with shield as a ground ..I have used a 60/40 silver mix its about the same price as regular solder and use acid etch for the fluxing compound. Remember we are talking small amounts of Of a Product made for fluxing I think from C-line ,,don't go out and try 2normal Sulfuric...clean the joint with the acid first and a q-tip then pre tin and then bond ....Well good luck on this I know its a real tough one...From the E....
2007-09-19 05:47:16 · answer #1 · answered by Edesigner 6 · 0⤊ 0⤋
How clean the surfaces are is important as well as the flux that you use.Your temperature is to low. You need at least 600 degrees F to do the job correctly. Copper would be a good material for the EMI shields with a tin coating. Copper on the steel would also work. Your present soldering temperature works out to 428 degrees F, which is far to low.
2007-09-19 12:26:49 · answer #2 · answered by Anonymous · 0⤊ 0⤋
You might try 8 to 10 microns of low-stress nickel.
Doug
2007-09-19 12:25:05 · answer #3 · answered by doug_donaghue 7 · 0⤊ 0⤋