How can i cut silicon solar cells?

Question

I've tried using diferent tools and even heating them to reduce cell's fragility without luck. They always break in some other direction. THANKS

Answer 1

the term is cleaving. You want to cleave the wafer along a crystal axis. The easiest way to do this is get a very hard clean flat surface. put the wafer/cell/device on this surface. get a very very sharp fine point metal tool. push the very point of the tool down on the very edge of the wafer. Do not saw or shake, just push. Increase presure without shaking your hands and the wafer will crack along a crystal axis. It might not crack along the axis you want and might destroy your device but you will at least know the direction of the axis after youve done it. The key is to push straight down on the very edge of the wafer without vibrating your tool.

Good luck.

Answer 2

often, slicing silicon is actual fairly undemanding. you basically could scratch the fabric with something very annoying and then crack it. the fabric will destroy alongside the line of the scratch. Glass makers do it constantly. Silicon wafers in foundries additionally are finished this variety. They use a diamond gadget to scratch alongside the line they desire it to interrupt then prepare rigidity alongside the scratch. even nonetheless, there are problems. The scratch ought to be precisely the superb intensity. Too shallow and the encircling fabric will shatter or the destroy will propagate faraway from the line shattering the fabric in an undesirable area. especially situations the fabric isn't flat maximum advantageous to various scratch intensity. besides, it is extremely appropriate that the destroy would not return and forth by way of factors that have an electric powered function. In wafers, they permit a niche between die for this purpose. The destroy interior the direction of the wafer may well be oblique so the scribe channel could be made extremely extensive to allow for this. on your case, i don't think of what you have in ideas is functional. From what i can confirm, most of the exterior is used.

Answer 3

You pretty much need a very expensive saw or a laser cutter. You have to know what the crystal direction is and cut along that.