EIA standard for packing - through hole component.?

Question

Hi there, now I am working on packaging my electronic component, it is through hole. Normally through hole type model we pack using vacuum tray only. But now I need to pack in in tape and reel version, just like Surface Mount component. So I have to refer to EIA standard. Does anyone here know where should I get from internet the details of this standard. Pls provide website where I can refer to.

Answer 1

Go to any manufacturer of ICs (sony, philips, NSC etc...)
Get data sheets.
On data sheets, they have packaging information. Use it.
BTW, ICs in Dual-in-line (through holes) do NOT come on tapes, but in TUBES.
Only components like caps and resistors come that way.
You can also find the standards of these in looking at component's manufacturers.
But why the hell do you want to do that???