Why are the heat sinks glued on top of microprocessor chips shaped like a series of fins?

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This is a Physics concept question and I have no idea.

2007-12-02 10:32:30 · 2 answers · asked by JQ 9 2 in Science & Mathematics ➔ Physics

To increase the amount of surface area that is exposed to the air. More surface area exposed to air = more capacity to disipate the heat.

2007-12-02 10:40:25 · answer #1 · answered by 2007_Shelby_GT500 7 · 0⤊ 0⤋

Because for a heat sink of any kind,
you want to maximize the surface area of the heat sink,
for a given volume.

2007-12-02 10:50:30 · answer #2 · answered by Anonymous · 0⤊ 0⤋