An IC has a die area of 0.65cm2 and being produced using an 8 inch wafer. The yield is 50%.
a. What is the cost per die? Assume the wafer cost is $2000.00.
b.If the die area is increased and we want to maintain yield, what can we do?
2006-09-21 09:21:44 · 2 answers · asked by cude84 1 in Science & Mathematics ➔ Mathematics
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2006-09-22 04:10:29 · answer #1 · answered by Just enquiring/ inquiring 4 · 0⤊ 0⤋
a. 8 inch circular wafer has a total area of 3.14*(8/2)^2*2.54=127.61cm2
Each wafer consists of 127.61/0.65=196 broken and unbroken dies. Approximately 3.14*8*2.54/SQRT(0.65*2)=73 dies are broken. Yield is 50%*(196-73)=61 dies per a wafer. The cost per die will be $2000/61=$33
b. we should increase wafer size.
2006-09-25 07:32:57 · answer #2 · answered by oleg_arch 2 · 0⤊ 0⤋