I am making a model of the heating of silicon wafer... I am trying to figure out things that I should include in my model.
For now i have these things.
Heat transfer ( am doing this with finite elements steps)
Using black body radiation terms to show heat loss (i am modeling in vacum.
It is connected to a steel ring, so I have to have another term for that.
Is the a differance in thermal conductivity that depends on direction of heat flow???
any good ways to show that the conductivity changes with respect to temperature???
is there any thing else that I have not taken in to account???
any good advice from any one out there???
2006-06-26 06:32:45 · 3 answers · asked by farrell_stu 4 in Science & Mathematics ➔ Physics
I am in grad school... I am just trying to get a good idea on how to improve my models (both anylitic and numeric
2006-06-26 07:18:15 · update #1
as I get further I am going to have to add a thin film on top of the wafer, but I am looking at the wafer for the moment. (the thin film is just included for the black body term at the moment)
2006-06-26 07:21:12 · update #2
Conductivity does not depend on direction of heat flow.
Found a paper on thermal conductivity see Fig 3
2006-06-26 07:04:42 · answer #1 · answered by georgephysics13 3 · 0⤊ 0⤋
Radiation loss, change in resistance, phase changes, Crystal structure change
The list can go on and on. Its up to you to choose what to model and do it as best as you can.
2006-06-26 13:36:44 · answer #2 · answered by ag_iitkgp 7 · 0⤊ 0⤋
Are you in high school or university? That's very dificult
2006-06-26 13:37:52 · answer #3 · answered by ATE 1 · 0⤊ 0⤋