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This new thin heat-flux sensor offers a broad range of possible applications. The targeted field of use was package characterisation, especially in order to determine the model parameter values of the dynamic compact models.
Three proposed fields of application are outlined below. However all the three presented applications are in connection with package thermal characterisation, we think that the utility of the presented sensor is much broader. Especially broad applicability is expected for the sensor matrix arrangement realisation that enables even heat flux mapping.

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2006-04-07 18:38:19 · 2 個解答 · 發問者 rrat 2 in 社會與文化 語言

2 個解答

This new thin heat-flux sensor offers a broad range of possible applications. The targeted field of use was package characterization, especially in order to determine the model parameter values of the dynamic compact models.此一新的溫度感應器提供一較大應用範圍,使用目標領域為其封裝特性,尤其是用以決定動力迷你機型的參數值。Three proposed fields of application are outlined below. However all the three presented applications are in connection with package thermal characterization, we think that the utility of the presented sensor is much broader. Especially broad applicability is expected for the sensor matrix arrangement realization that enables even heat flux mapping.應用的三個提議範圍概述如下,然而,三個提出的應用範圍皆與封裝熱特性有關,我們認為所提出的溫度感應器的用途更廣泛,尤其是獲得其廣泛應用於溫度感應器矩陣排列是可預期的,甚至可以達成熱焀製圖。

2006-04-08 09:27:38 · answer #1 · answered by River 7 · 0 0

這個新的薄的熱熔感應器提供一個廣大範圍的可能性應用.
目標範疇使用是套裝軟體特性描述,特別是為了測量動力緊密模型的參數值.
應用的三個提議範疇概述如下.然而所有這三個提出的應用是與套裝軟體熱的特性描述有關,我們認為此提出的感應器是更廣的.特別廣範的應用性是被期待的對於感應器基質排列真實性,甚至使熱焀製圖成為可能.

2006-04-07 19:04:58 · answer #2 · answered by 小蚊子 2 · 0 0

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